8 August 1993 Performance of a 0.5 NA broadband DUV step-and-scan system
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Abstract
The Micrascan II is a 0.50 NA DUV, broadband illumination (245 nm to 252 nm) step-and- scan exposure system manufactured by Silicon Valley Group Lithography Systems, Inc. (SVGL) of Wilton, Connecticut. The tool has been designed to provide 350 nm resolution and 90 nm overlay (mean + 3 sigma) in a semiconductor manufacturing environment. The system utilizes a reticle-limited field size of 22.0 X 32.5 mm. Lithographic and system performance testing of pre-production and production versions of the Micrascan II have been performed. Data from the source acceptance testing of the preproduction tool, as well as product level overlay results, are presented. The production tool acceptance test data are also presented along with results of the first SEMATECH marathon cluster test simulating a manufacturing environment. The production tool is integrated with an SVG 90 series track providing all pre-exposure and post-exposure wafer processing. All work reported has been accomplished using 200 mm wafer substrates.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mark William Barrick, Mark William Barrick, Doug Bommarito, Doug Bommarito, Karey L. Holland, Karey L. Holland, Katherine C. Norris, Katherine C. Norris, Bob Patterson, Bob Patterson, Yumiko Takamori, Yumiko Takamori, Joseph C. Vigil, Joseph C. Vigil, Timothy J. Wiltshire, Timothy J. Wiltshire, } "Performance of a 0.5 NA broadband DUV step-and-scan system", Proc. SPIE 1927, Optical/Laser Microlithography, (8 August 1993); doi: 10.1117/12.150455; https://doi.org/10.1117/12.150455
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