14 December 1992 Chip to chip optical interconnects in a multichip module architecture
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Proceedings Volume 1929, 17th International Conference on Infrared and Millimeter Waves; 19295O (1992) https://doi.org/10.1117/12.2298321
Event: 17th International Conference on Infrared and Millimeter Waves, 1992, Pasadena, CA, United States
Abstract
This paper examines the chip to chip integration of optical interconnects (01). A multilevel planar architecture for chip to chip optical interconnection using a carrier wavelength of 0.94 pm and Si3N4 waveguides on an AN Multichip Module (MCM) substrate is proposed. The use of turning mirrors, microlenses and other optical elements to improve the loss budget are presented.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James A. Holmes, James A. Holmes, } "Chip to chip optical interconnects in a multichip module architecture", Proc. SPIE 1929, 17th International Conference on Infrared and Millimeter Waves, 19295O (14 December 1992); doi: 10.1117/12.2298321; https://doi.org/10.1117/12.2298321
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