Abstract
The Signal Processor Packaging Design (SPPD) program was a technology development effort to demonstrate that a miniaturized, high throughput programmable processor could be fabricated to meet the stringent environment imposed by high speed kinetic energy guided interceptor and missile applications. This successful program culminated with the delivery of two very small processors, each about the size of a large pin grid array package. Rockwell International's Tactical Systems Division in Anaheim, California developed one of the processors, and the other was developed by Texas Instruments' (TI) Defense Systems and Electronics Group (DSEG) of Dallas, Texas. The SPPD program was sponsored by the Guided Interceptor Technology Branch of the Air Force Wright Laboratory's Armament Directorate (WL/MNSI) at Eglin AFB, Florida and funded by SDIO's Interceptor Technology Directorate (SDIO/TNC). These prototype processors were subjected to rigorous tests of their image processing capabilities, and both successfully demonstrated the ability to process 128 X 128 infrared images at a frame rate of over 100 Hz.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul L. McCarley, Paul L. McCarley, Mickie Ann Phipps, Mickie Ann Phipps, } "Signal processor packaging design", Proc. SPIE 1957, Architecture, Hardware, and Forward-Looking Infrared Issues in Automatic Target Recognition, (20 October 1993); doi: 10.1117/12.161436; https://doi.org/10.1117/12.161436
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