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A bonding strategy was developed for joining carbon/carbon composites and beryllium to copper. The methodology used was first to control the interface properties by employing ion beam enhanced deposition (IBED) on the surface of the specimen. This process allowed the formation of a graded interface layer to alleviate the mismatch in coefficient of thermal expansion and an additional surface layer to be deposited for subsequent bonding. Joining was then performed using a traditional diffusion bonding technique or an infrared assisted bonding technique. The integrity of the joint was determined by nondestructive measurement of the thermal conductance through the joint. Extremely high values of thermal conductance were registered, indicating that very high quality joints were obtained.
Jyh-Ming Ting,Max L. Lake,Ray Y. Lin, andChris Eppich
"Joining strategy for high heat flux materials", Proc. SPIE 1997, High Heat Flux Engineering II, (12 November 1993); https://doi.org/10.1117/12.163799
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Jyh-Ming Ting, Max L. Lake, Ray Y. Lin, Chris Eppich, "Joining strategy for high heat flux materials," Proc. SPIE 1997, High Heat Flux Engineering II, (12 November 1993); https://doi.org/10.1117/12.163799