PROCEEDINGS VOLUME 1999
SPIE'S 1993 INTERNATIONAL SYMPOSIUM ON OPTICS, IMAGING, AND INSTRUMENTATION | 11-16 JULY 1993
Adhesives Engineering
SPIE'S 1993 INTERNATIONAL SYMPOSIUM ON OPTICS, IMAGING, AND INSTRUMENTATION
11-16 July 1993
San Diego, CA, United States
Adhesives in Optical Applications I
Proc. SPIE 1999, New perspectives in polymer adhesion mechanisms--importance of diffusion and molecular bonding in adhesion, 0000 (27 September 1993); https://doi.org/10.1117/12.158592
Proc. SPIE 1999, Minimizing cement strain while cementing thin lenses using ultraviolet light, 0000 (27 September 1993); https://doi.org/10.1117/12.158610
Proc. SPIE 1999, Mechanisms relating to reducing stress in curing thick sections of UV adhesives, 0000 (27 September 1993); https://doi.org/10.1117/12.158613
Proc. SPIE 1999, Cold lens blocking methods, 0000 (27 September 1993); https://doi.org/10.1117/12.158614
Proc. SPIE 1999, Effects of military environments on optical adhesives, 0000 (27 September 1993); https://doi.org/10.1117/12.158615
Proc. SPIE 1999, Outgassing: an atypical approach, 0000 (27 September 1993); https://doi.org/10.1117/12.158616
Adhesives in Optical Applications II
Proc. SPIE 1999, Finite-element analysis of adhesive butt joints in fiber optic devices, 0000 (27 September 1993); https://doi.org/10.1117/12.158617
Proc. SPIE 1999, Causes for separation in UV adhesive bonded optical assemblies, 0000 (27 September 1993); https://doi.org/10.1117/12.158618
Proc. SPIE 1999, Glass-on-chip package for CCDs, 0000 (27 September 1993); https://doi.org/10.1117/12.158593
Proc. SPIE 1999, Inverted microscope refitted for the testing of epoxy coating debonding induced by indenters on the glass substrates, 0000 (27 September 1993); https://doi.org/10.1117/12.158594
Adhesives in Structural Bonding I
Proc. SPIE 1999, Dual cracking at polymer/glass interfaces, 0000 (27 September 1993); https://doi.org/10.1117/12.158595
Proc. SPIE 1999, Measurement of mixed mode (I,II) stress intensity factors (SIFs) of an interface crack by the optical method of caustics, 0000 (27 September 1993); https://doi.org/10.1117/12.158596
Proc. SPIE 1999, Measurement of bimaterial interface fracture parameters using modified SEN beam specimens and coherent gradient sensing, 0000 (27 September 1993); https://doi.org/10.1117/12.158597
Proc. SPIE 1999, Adhesion strength and inversely-determined nonlinear Young's moduli for die-attach adhesives, 0000 (27 September 1993); https://doi.org/10.1117/12.158598
Proc. SPIE 1999, Fracture energy of ice/metal interfaces, 0000 (27 September 1993); https://doi.org/10.1117/12.158599
Adhesives in Structural Bonding II
Proc. SPIE 1999, Testing and computer modeling of adhesives in bulk and bonded states, 0000 (27 September 1993); https://doi.org/10.1117/12.158600
Proc. SPIE 1999, Calibration of the plane strain mixed mode pullout delamination specimen, 0000 (27 September 1993); https://doi.org/10.1117/12.158601
Proc. SPIE 1999, Test efficiency: a simple parameter for comparing adhesive fracture tests for adhesion measurement, 0000 (27 September 1993); https://doi.org/10.1117/12.158602
Adhesives in Structural Bonding III
Proc. SPIE 1999, Nondestructive testing of bonded structures with Reverse Geometry X-ray imaging, 0000 (27 September 1993); https://doi.org/10.1117/12.158603
Proc. SPIE 1999, Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bonds, 0000 (27 September 1993); https://doi.org/10.1117/12.158604
Proc. SPIE 1999, Dynamic response of mode III interface crack in bonded materials, 0000 (27 September 1993); https://doi.org/10.1117/12.158605
Proc. SPIE 1999, Effect of dislocations in multilayer media, 0000 (27 September 1993); https://doi.org/10.1117/12.158606
Proc. SPIE 1999, Dynamic failure analysis of bimaterial beam with crack tip terminating interface, 0000 (27 September 1993); https://doi.org/10.1117/12.158607
Proc. SPIE 1999, Comparison of numerous lap joint theories for adhesively bonded joints, 0000 (27 September 1993); https://doi.org/10.1117/12.158608
Proc. SPIE 1999, Suitability of various blister tests for thin film adhesion tests, 0000 (27 September 1993); https://doi.org/10.1117/12.158609
Proc. SPIE 1999, Failure analysis of adhesively bonded composite joint: an elasto-plastic approach, 0000 (27 September 1993); https://doi.org/10.1117/12.158611
Proc. SPIE 1999, Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure, 0000 (27 September 1993); https://doi.org/10.1117/12.158612
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