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New perspectives in polymer adhesion mechanisms--importance of diffusion and molecular bonding in adhesion
Inverted microscope refitted for the testing of epoxy coating debonding induced by indenters on the glass substrates
Measurement of mixed mode (I,II) stress intensity factors (SIFs) of an interface crack by the optical method of caustics
Measurement of bimaterial interface fracture parameters using modified SEN beam specimens and coherent gradient sensing
Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bonds
Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure