27 September 1993 Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure
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Abstract
Holographic Interferometry techniques have been successfully employed to characterize and test the behavior of structures under stress. These techniques are especially suited to investigating the efficacy of bonds at the interfaces of different materials in complex laminated structures. Complex bonded structures of highly dissimilar materials are often difficult to characterize with radiographic, ultrasonic, or other 'conventional' techniques. Such structures can present great variations in density and extremes in bond strength, as well as tremendous dimensional differences which may foil such non-destructive evaluation. These are ideal requisites, however, for analysis using advanced real-time and multi-exposure holographic methods.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Howard Fein, "Application of holographic interferometry to the characterization of the dynamics of a complex bonded structure", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158612; https://doi.org/10.1117/12.158612
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KEYWORDS
Holography

Holograms

Holographic interferometry

Nondestructive evaluation

Adhesives

Fringe analysis

Optical fabrication

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