Finite-element analysis of adhesive butt joints in fiber optic devices

John A. Sultana; Daniel R. O'Brien; Steven E. Forman

doi:10.1117/12.158617

27 September 1993 Finite-element analysis of adhesive butt joints in fiber optic devices

John A. Sultana, Daniel R. O'Brien, Steven E. Forman

Proceedings Volume 1999, Adhesives Engineering; (1993) https://doi.org/10.1117/12.158617
Event: SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, 1993, San Diego, CA, United States

Abstract

The performance stability of a contacting butt-joint type of fiber attachment method, which is commonly used in the fiber optic industry, is evaluated in this paper. The particular butt joint design in question is a glass fiber bonded to a lithium niobate Mach-Zehnder modulator using UV curing optical adhesive. The joint is susceptible to optical loss levels that can increase with repeated thermal cycles, unless the fiber attachment method is carefully carried out. Difficulties have occurred during the warm portions of thermal cycles and subsequent microscopic analyses of failed devices suggested the presence of adhesive delamination at fiber-to-modulator joints.

Citation Download Citation

John A. Sultana, Daniel R. O'Brien, and Steven E. Forman "Finite-element analysis of adhesive butt joints in fiber optic devices", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); https://doi.org/10.1117/12.158617

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