27 September 1993 Glass-on-chip package for CCDs
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Electronic still cameras capture images with CCDs instead of silver halide film. However, the laws of optics continue to apply, and the active area of the CCD must be located in the focal plane of the camera optics. Typically, this means that the CCD is actively aligned during camera assembly. It is desirable to avoid this alignment operation. One way of circumventing alignment is to assemble the CCD in a package with a reference surface that is mechanically coupled to the surface of the CCD. This reference surface can then be mated to the camera optics, and alignment is automatic. We have developed a Glass-on-Chip package that uses optical adhesives to bond a shaped piece of glass directly to the surface of a CCD after wire bonding. If the glass thickness is controlled, this package meets the requirements for passive alignment of CCD to optics. Properties of the adhesive are critical to the success of this approach. The adhesive must be optically transparent, heat curable and compatible with the polymeric color filters already on the CCD.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Maurice S. Karpman, Christopher Reiche, "Glass-on-chip package for CCDs", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); doi: 10.1117/12.158593; https://doi.org/10.1117/12.158593

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