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1 November 1993 Miniature FPA/IDCA: progress report
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Abstract
Two-dimensional infrared focal plane array detectors in general are characterized by a significantly larger size and thermal mass than the traditional discrete element detectors. Usually, they contain an `on-board' signal processor. The size and thermal mass impact is significant in the radiation shield/cold optics subassembly. In order to achieve miniaturization, low input power and fast cool down time, a combined team of Cincinnati Electronics Corporation, Mason, Ohio and RICOR-Cryogenic and Vacuum Systems, EnHarod (IHUD), Israel are working on the development of a Miniature Integral Cooler/Dewar Assembly-IDCA specially tailored for 2-D FPA type detectors. A progress report, based on accumulated experimental data gathered through the operation of engineering models of this type in a laboratory level and in a system level under various conditions, is presented.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gregory R. Leonard, J. Brian Toft, Jan Tollefson, Nachman Pundak, and D. Admon "Miniature FPA/IDCA: progress report", Proc. SPIE 2020, Infrared Technology XIX, (1 November 1993); https://doi.org/10.1117/12.160575
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