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1 February 1994 Influence of the stress state in silicon on the anisotropic etching process
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This paper presents evidence of the influence of the state of stress on anisotropic etching of (100) oriented Si in KOH water solution. External load is applied to strips of Si which modifies the initial internal stress state actually generated by a patterned SiO2 masking film. Results obtained for circular patterns indicate that the etch patterns on the strips subjected to negative and positive stresses are different from each other and are different from strips which have not been subjected to external loads. These observations indicate that the etching process is influenced by the presence of stresses in the silicon. A technique to analyze the stress is proposed. The resulting variations of etched features with applied stress is significant.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ion G. Stiharu, Rama B. Bhat, Mojtaba Kahrizi, and Leslie M. Landsberger "Influence of the stress state in silicon on the anisotropic etching process", Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994);

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