1 February 1994 Laser processing of palladium for selective electroless copper plating
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Abstract
Various methods for laser-assisted activation of dielectric layers for selective electroless copper plating are investigated. The direct writing of palladium feature by the Ar+ laser-induced pyrolytic decomposition of an organometallic palladium resin on polyimide and Si3N4 leads to active Pd sites which are selectively copper plated. Other laser-induced processes for selective palladium seeding are studied. It is also shown that those are efficient seeding processes for the electroless plating of copper.
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Marie-Helene Bernier, Ricardo Izquierdo, Michel Meunier, "Laser processing of palladium for selective electroless copper plating", Proc. SPIE 2045, Laser-Assisted Fabrication of Thin Films and Microstructures, (1 February 1994); doi: 10.1117/12.167577; https://doi.org/10.1117/12.167577
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