Flexible multisensor inspection system for solder-joint analysis

Gerard Lacey; Ronan Waldron; Jean-Marc Dinten; Francis Lilley

doi:10.1117/12.150293

6 August 1993 Flexible multisensor inspection system for solder-joint analysis

Gerard Lacey, Ronan Waldron, Jean-Marc Dinten, Francis Lilley

Proceedings Volume 2064, Machine Vision Applications, Architectures, and Systems Integration II; (1993) https://doi.org/10.1117/12.150293
Event: Optical Tools for Manufacturing and Advanced Automation, 1993, Boston, MA, United States

Abstract

This paper describes the design and construction of an open, automated, solder bond verification machine for the electronics manufacturing industry. The application domain is the higher end assembly technologies, with an emphasis on fine pitch surface mount components. The system serves a measurement function, quantifying the solder bonds. It interfaces with the manufacturing process to close the manufacturing loop. A geometric model of the solder in a joint, coupled with a finite element analysis of the physical properties of solder, lead to objective measurement of the solder. Principle illumination systems are laser, X-ray and noncoherent lighting. Open, Objected Oriented design and implementation practices enable a forward looking system to be developed.

Citation Download Citation

Gerard Lacey, Ronan Waldron, Jean-Marc Dinten, and Francis Lilley "Flexible multisensor inspection system for solder-joint analysis", Proc. SPIE 2064, Machine Vision Applications, Architectures, and Systems Integration II, (6 August 1993); https://doi.org/10.1117/12.150293

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