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15 February 1994 Improvements in two-dimensional X/Y metrology on photomasks and wafers
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Abstract
Recently Leica introduced a new X/Y Metrology system called the LMS 2020. Performance results indicate an approximate 30% improvement over the existing model--the LMS 2000. Through-put, design grid accuracy, and precision have all been incrementally improved to varying degrees. Information presented includes: brief background description of the tool, a description of the measurement algorithms used to obtain the data, and the specific performance results obtained through measurements on both photomasks and wafers.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John M. Whittey "Improvements in two-dimensional X/Y metrology on photomasks and wafers", Proc. SPIE 2087, 13th Annual BACUS Symposium on Photomask Technology and Management, (15 February 1994); https://doi.org/10.1117/12.167258
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