Elimination of stress-induced voids on AlCu multilevel interconnect lines

Gordon Grivna; John L. Freeman; Clarence J. Tracy

doi:10.1117/12.156518

15 September 1993 Elimination of stress-induced voids on AlCu multilevel interconnect lines

Gordon Grivna; John L. Freeman; Clarence J. Tracy

Author Affiliations +

Proceedings Volume 2090, Multilevel Interconnection: Issues That Impact Competitiveness; (1993) https://doi.org/10.1117/12.156518
Event: Microelectronic Processing '93, 1993, Monterey, CA, United States

Abstract

Multilevel metal (MLM) structures utilizing four layers of large grain size Al 1.5% Cu metallization have displayed `in process' stress voiding in metal layers two through four upon completion of final passivation and anneal. Changing the deposited dielectric stress from 2E8 dynes/cm² to a slightly more compressive 1.25E9 dynes/cm² eliminated the formation of `in process' stress voids. However, thermal stressing at 200 degree(s)C still produced stress voiding in metal layers two and three. The addition of a 125 angstrom TiW cap to the second, third, and fourth metal layer was shown to eliminate both `in process' stress voids and long term 200 degree(s)C thermal stress induced metal line voids on all material with standard dielectric thicknesses. The results comparing various dielectric stress levels and metal structures with and without a TiW cap are reported here.

Citation Download Citation

Gordon Grivna, Gordon Grivna, John L. Freeman, John L. Freeman, Clarence J. Tracy, Clarence J. Tracy, } "Elimination of stress-induced voids on AlCu multilevel interconnect lines", Proc. SPIE 2090, Multilevel Interconnection: Issues That Impact Competitiveness, (15 September 1993); doi: 10.1117/12.156518; https://doi.org/10.1117/12.156518

ACCESS THE FULL ARTICLE

PERSONAL SIGN IN
Full access may be available with your subscription

Email or Username Forgot your username?

Password Forgot your password?

Show

Remember Email/Username on this computer

Remember Password

No SPIE account? Create an account
or Institutional Sign In via Shibboleth

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $14.40

Non-members: $18.00 ADD TO CART

Show All Keywords

Keywords/Phrases

Search In:

Publication Years