Software integration of in-situ spectroscopic ellipsometry

Sonny Maung; Steven A. Henck; Walter M. Duncan; Doug Mahlum; Chyi Sheng

doi:10.1117/12.167360

15 February 1994 Software integration of in-situ spectroscopic ellipsometry

Sonny Maung, Steven A. Henck, Walter M. Duncan, Doug Mahlum, Chyi Sheng

Proceedings Volume 2091, Microelectronic Processes, Sensors, and Controls; (1994) https://doi.org/10.1117/12.167360
Event: Microelectronic Processing '93, 1993, Monterey, CA, United States

Abstract

In situ sensors are key tools for flexible manufacturing environments where wafers with diverse specifications are processed interspersed through common chambers. This is in contrast to conventional batch processing where pilot wafers, ex situ measurement, and statistical method are employed for process control. In the present work, we discuss integration of in situ spectral ellipsometry (SE) into several processes of a flexible manufacturing environment. In situ SE enables real-time wafer-to-wafer compensation for equipment and process drifts and also equipment prognosis. The capability of the TI SE is discussed together with the implementation issues of solving the inverse problem in real time. A robust endpoint detection algorithm using TI SE is presented. Also addressed are the issues in the integration of the SE with the machine control as well as with the computer integrated manufacturing factory for feedforward and feedback control.

Citation Download Citation

Sonny Maung, Steven A. Henck, Walter M. Duncan, Doug Mahlum, and Chyi Sheng "Software integration of in-situ spectroscopic ellipsometry", Proc. SPIE 2091, Microelectronic Processes, Sensors, and Controls, (15 February 1994); https://doi.org/10.1117/12.167360

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