Paper
30 August 1993 Characteristics of microstrip lines with finite metallization thickness and turning-up edge for high power transmission
Ao Sheng Rong
Author Affiliations +
Proceedings Volume 2104, 18th International Conference on Infrared and Millimeter Waves; 210456 (1993) https://doi.org/10.1117/12.2298618
Event: 18th International Conference on Infrared and Millimeter Waves, 1993, Colchester, United Kingdom
Abstract
This paper presents a Quasi-TEM analysis of the microstriplines with the finite metallisation thickness and turning-up edges.The characteristic impedance and effective dielectric constant aregiven as functions of the metallisation thickness and turning-upprofile of the edges. At the extreme case where the metallisationthickness is assumed to be zero and the turning-up profile of theedges is of the circular arc, the calculated results are comparedwith the measured data available in literatures. This modifiedconfiguration of the microstrip lines exhibits great potential forhigh power transmission.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ao Sheng Rong "Characteristics of microstrip lines with finite metallization thickness and turning-up edge for high power transmission", Proc. SPIE 2104, 18th International Conference on Infrared and Millimeter Waves, 210456 (30 August 1993); https://doi.org/10.1117/12.2298618
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KEYWORDS
Adaptive optics

Dielectrics

Extremely high frequency

Sun

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