Paper
30 August 1993 Modal analysis of microstrip and fine line step discontinuities for microwave and millimeter-wave integrated-circuits applications
Author Affiliations +
Proceedings Volume 2104, 18th International Conference on Infrared and Millimeter Waves; 21045A (1993) https://doi.org/10.1117/12.2298622
Event: 18th International Conference on Infrared and Millimeter Waves, 1993, Colchester, United Kingdom
Abstract
Modal analysis of microstrip and flnline stepjunctions, commonly seen in microwave and millimeter-waveintegrated circuits, are derived. Numerical results ofscattering parameters are presented in W-band (75 - 110 GHz).There is a good agrrement between our calculated results andpublished data.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cam Nguyen "Modal analysis of microstrip and fine line step discontinuities for microwave and millimeter-wave integrated-circuits applications", Proc. SPIE 2104, 18th International Conference on Infrared and Millimeter Waves, 21045A (30 August 1993); https://doi.org/10.1117/12.2298622
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KEYWORDS
Microwave radiation

Modal analysis

Integrated circuits

Scattering

Content addressable memory

Dielectrics

Electrical engineering

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