30 August 1993 Modal analysis of microstrip and fine line step discontinuities for microwave and millimeter-wave integrated-circuits applications
Author Affiliations +
Proceedings Volume 2104, 18th International Conference on Infrared and Millimeter Waves; 21045A (1993) https://doi.org/10.1117/12.2298622
Event: 18th International Conference on Infrared and Millimeter Waves, 1993, Colchester, United Kingdom
Abstract
Modal analysis of microstrip and flnline stepjunctions, commonly seen in microwave and millimeter-waveintegrated circuits, are derived. Numerical results ofscattering parameters are presented in W-band (75 - 110 GHz).There is a good agrrement between our calculated results andpublished data.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cam Nguyen, Cam Nguyen, "Modal analysis of microstrip and fine line step discontinuities for microwave and millimeter-wave integrated-circuits applications", Proc. SPIE 2104, 18th International Conference on Infrared and Millimeter Waves, 21045A (30 August 1993); doi: 10.1117/12.2298622; https://doi.org/10.1117/12.2298622
PROCEEDINGS
2 PAGES


SHARE
Back to Top