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1 June 1994 Simple and effective method for characterizing dynamic properties of distributed feedback lasers at the chip level
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Abstract
Distributed feedback (DFB) semiconductor lasers are now widely used in long-haul high- capacity optical fiber transmission systems operating in the 1.3 micrometers and 1.5 micrometers wavelength windows, with direct modulation bit-rates up to 2.488 gigabit/s. Some form of link test over fiber is usually necessary to evaluate the dynamic performance of DFB lasers for potential application in actual systems, which requires considerable test time and equipment. Moreover, thermal considerations often dictate that this test be performed only after the chip is bonded to a heat sink and fully assembled. In this paper we present a study of the dynamic properties of DFB lasers at the chip level focusing on both side- and main-mode characteristics, using a simple technique which employs low duty cycle pulses. Our measurements were performed on some 1.5 micrometers DFB laser chips. To show the validity of the chip-level results, we followed up with measurements of the same chips after bonding to a diamond heat sink, and also after a burn-in period. For comparison, a more extensive link test over fiber was also performed on the same lasers.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kin-Wai Leong, John Yu, Robert Parkinson, and Stephen Yu "Simple and effective method for characterizing dynamic properties of distributed feedback lasers at the chip level", Proc. SPIE 2148, Laser Diode Technology and Applications VI, (1 June 1994); https://doi.org/10.1117/12.176638
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