2 May 1994 High-speed optoelectronic multichip modules packaged in glass on silicon
Author Affiliations +
Future communication and computer systems will require major advances in the integration of optical, optoelectronic and high- speed electronic componenets if packaging costs are to be reduced to acceptable levels. A hybrid integration approach called optoelectroic glass microwave integrated circuit (opto-GMIC) has been developed. Opto-GMIC comprises a glass substrate on a silicon carrier which can accommodate discrete and monolithic microwave and optoelectronic devices. In addition, fibre alignment grooves that simplify pigtailing can be defined. Hence a wide variety of high-speed optoelectronic multichip module designs can ultimately be produced from the same production line. In contrast to rival monolithic optoelectronic integrated circuit (OEIC) technologies, opto-GMIC can interconnect devices fabricated from different materials. This feature has been demonstrated by the fabrication of prototype fibre-optic repeaters, transmitters and receivers. These modules are designed for synchronous optical network (SONET) applications at a bit rate of 622.08 Mb/s and at a wavelength of 1.3 micrometers . All electronic functions on the modules are performed by GaAs microwave monolithic integrated circuits (MMICs) while optoelectronic functions are provided by InGaAs photodiodes and InGaAsP laser diodes. By off-loading electronic passive elements onto glass, the number of parts in assembly is reduced drastically.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stavros Iezekiel, Eric A. Soshea, Matthew F. J. O'Keefe, Christopher M. Snowden, "High-speed optoelectronic multichip modules packaged in glass on silicon", Proc. SPIE 2149, Technologies for Optical Fiber Communications, (2 May 1994); doi: 10.1117/12.175260; https://doi.org/10.1117/12.175260

Back to Top