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Optically interconnected multichip module based on computer-generated holograms and flip-chip technology
Planar formation of 3D highly parallel optical fan-out interconnects for wafer scale optical clock signal distribution
Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors
Multiple diffraction of massive fanout optical interconnects based on multiplexed waveguide holograms
Design limitations of highly parallel free-space optical interconnects based on arrays of vertical-cavity surface-emitting laser diodes, microlenses, and photodetectors