Design considerations for high packaging density optical bus array

Suning Tang; Ray T. Chen; David J. Gerold; Maggie M. Li; Srikanth Natarajan; Jengping Lin; N. Chellappan; Mark A. Peskin

doi:10.1117/12.174511

2 May 1994 Design considerations for high packaging density optical bus array

Suning Tang, Ray T. Chen, David J. Gerold, Maggie M. Li, Srikanth Natarajan, Jengping Lin, N. Chellappan, Mark A. Peskin

Author Affiliations +

Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174511
Event: OE/LASE '94, 1994, Los Angeles, CA, United States

Abstract

In this paper, a crosstalk model is developed to study the packing density and interconnect distance limitations of an optical interconnect system employing polymer-based single-mode bus arrays. The upper limit of channel packing density (1250 channels/cm at interconnect distance of 5 cm) is determined for the first time using the crosstalk model, in which channel cross-coupling among an infinite number of waveguides is considered. Computer simulations are provided together with the proven experimental results. It is shown that there is a threshold of channel separation due to channel cross-coupling, which results in a tradeoff between channel packing density and interconnect distance. Waveguide dimension closer to the cutoff boundary of second mode (E₁₂^X) is preferred for an optimum design.

Citation Download Citation

Suning Tang, Ray T. Chen, David J. Gerold, Maggie M. Li, Srikanth Natarajan, Jengping Lin, N. Chellappan, and Mark A. Peskin "Design considerations for high packaging density optical bus array", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174511

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