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2 May 1994 Optically interconnected multichip module based on computer-generated holograms and flip-chip technology
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Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174533
Event: OE/LASE '94, 1994, Los Angeles, CA, United States
Abstract
For the past few years we have been working on the development of an optically interconnected multichip module (MCM). The MCM is composed of a planar transparent substrate, containing thin film electrical connections. GaAs laser array chips and silicon CMOS VLSI chips with integrated photodetectors are flip-chip bonded to one side of the substrate, while computer generated holograms (CGHs) are fabricated on the other side of the substrate. The purpose of this work is to develop the technology to enable high speed and high density connections between chips, MCMs, and PC boards. We believe that the basic approach we use, based on flip-chip and CGH technology, will provide 1-2 orders of magnitude increase in connection performance when compared with conventional electrical connectors.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael R. Feldman, Waddie Heyward, Paul A. Magill, Hedong Yang, and James E. Morris "Optically interconnected multichip module based on computer-generated holograms and flip-chip technology", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174533
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