Planar formation of 3D highly parallel optical fan-out interconnects for wafer scale optical clock signal distribution

Suning Tang; Ray T. Chen

doi:10.1117/12.174495

2 May 1994 Planar formation of 3D highly parallel optical fan-out interconnects for wafer scale optical clock signal distribution

Suning Tang, Ray T. Chen

Author Affiliations +

Proceedings Volume 2153, Optoelectronic Interconnects II; (1994) https://doi.org/10.1117/12.174495
Event: OE/LASE '94, 1994, Los Angeles, CA, United States

Abstract

In this paper, we present a miniaturized compact 3-D optical fan-out interconnect suitable for wafer scale VLSI multichip module optical clock signal distribution. The demonstrated device employs a thin light-guiding substrate in conjunction with a 2-D optical hologram array. The parallel feature among fan-out beams and the planar compact structure convert the unsolvable three spatial and three angular multiple alignment problem into a single-step 2-D planar one, which greatly enhances the packaging reliability. A new design scheme for minimizing throughput power non-uniformity is presented for the first time. A 25 GHz 1-to-42 highly parallel fan-out interconnect was demonstrated with a signal to noise ratio of 10 dB.

Citation Download Citation

Suning Tang and Ray T. Chen "Planar formation of 3D highly parallel optical fan-out interconnects for wafer scale optical clock signal distribution", Proc. SPIE 2153, Optoelectronic Interconnects II, (2 May 1994); https://doi.org/10.1117/12.174495

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