10 June 1994 Integrated optoelectronic interconnect for phased-array antenna applications
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An integrated semiconductor interconnect chip is being developed for the distribution of microwave signals to the subarrays and/or radiating elements of a phased array antenna (PAA). The baseline chip design calls for a 1 X 4 distribution fanout, and consists of both waveguide splitters and integrated optical amplifiers to compensate for inherent splitting as well as excess waveguide and coupling losses. Analysis is being performed to evaluate the RF performance of photonic links containing semiconductor optical amplifiers, and to determine the most judicious use of such an interconnect in the photonic feed network of a PAA.
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Lawrence J. Lembo, Lawrence J. Lembo, Moshe Sergant, Moshe Sergant, Chan A. Tu, Chan A. Tu, Philip H. Wisseman, Philip H. Wisseman, Charles Zmudzinski, Charles Zmudzinski, John C. Brock, John C. Brock, "Integrated optoelectronic interconnect for phased-array antenna applications", Proc. SPIE 2155, Optoelectronic Signal Processing for Phased-Array Antennas IV, (10 June 1994); doi: 10.1117/12.177387; https://doi.org/10.1117/12.177387


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