1 May 1994 Thinned 4096x4096 CCD mosaic
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Abstract
A thinned-CCD mosaic was fabricated from four Loral 2048 X 2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a `flip-chip' wire-bonding technique followed by chemical dissolution of the glass support. The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael A. Damento, Michael A. Damento, Shun Lo, Shun Lo, Hans J. Meyer, Hans J. Meyer, Peter E. Doherty, Peter E. Doherty, Gary R. Sims, Gary R. Sims, Michael P. Lesser, Michael P. Lesser, } "Thinned 4096x4096 CCD mosaic", Proc. SPIE 2172, Charge-Coupled Devices and Solid State Optical Sensors IV, (1 May 1994); doi: 10.1117/12.172760; https://doi.org/10.1117/12.172760
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