1 May 1994 Noncontact power/interrogation system for smart structures
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Abstract
The field of smart structures has been largely driven by the development of new high performance designed materials. Use of these materials has been generally limited due to the fact that they have not been in use long enough for statistical data bases to be developed on their failure modes. Real time health monitoring is therefore required for the benefits of structures using these materials to be realized. In this paper a non-contact method of powering and interrogating embedded electronic and opto-electronic systems is described. The technique utilizes inductive coupling between external and embedded coils etched on thin electronic circuit cards. The technique can be utilized to interrogate embedded sensors and to provide > 250 mW for embedded electronics. The system has been successfully demonstrated with a number of composite and plastic materials through material thicknesses up to 1 cm. An analytical description of the system is provided along with experimental results.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William B. Spillman, William B. Spillman, S. Durkee, S. Durkee, } "Noncontact power/interrogation system for smart structures", Proc. SPIE 2191, Smart Structures and Materials 1994: Smart Sensing, Processing, and Instrumentation, (1 May 1994); doi: 10.1117/12.173966; https://doi.org/10.1117/12.173966
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