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1 May 1994 Thermal design methodology of hot and chill plates for photolithography
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Abstract
The major requirement for hot- and chill-plate designs is that they provide repeatable and uniform process conditions thereby assuring consistent photoresist quality. A collection of feature-based thermal models has been developed to predict temperature-time histories considering plate construction features including chuck heating/cooling methods, sensor placement with a PID control algorithm, and effects due to vacuum grooves, access holes, support pins and edge-gap. These models can be used by designers and process technologists to assess new approaches, optimize current design and set performance specifications.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David P. DeWitt, T. C. Niemoeller, Chris A. Mack, and Gil Yetter "Thermal design methodology of hot and chill plates for photolithography", Proc. SPIE 2196, Integrated Circuit Metrology, Inspection, and Process Control VIII, (1 May 1994); https://doi.org/10.1117/12.174144
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