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7 September 1994 Latest developments in laser manufacturing
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Proceedings Volume 2207, Laser Materials Processing: Industrial and Microelectronics Applications; (1994) https://doi.org/10.1117/12.184781
Event: Europto High Power Lasers and Laser Applications V, 1994, Vienna, Austria
Abstract
Laser processing can show its full capacity in the applications in which the laser is not hindered by the constraints imposed when the laser is inserted in conventional systems without reassessing the overall system design. In these cases the laser process performance up to now was kept at very low levels because conventional systems would not need nor accept higher ones. Instead now said performance must be brought to the upper limits inasmuch as the lasers will be the pacesetter for the performance of the new systems freed from all the old design bondages. `Augmented' laser multiprocessings obtained by combining the laser with conventional processes in a manner which take advantages of unexpected synergies permitted by the laser, allow the system to outperform, in all aspects from productivity to quality, the already much higher performance of dedicated all laser multi processing systems. Most important `augmented' laser multi-processing is the cut-bend-weld. At present one of the dedicated laser multiprocessings of greatest interest is the laser cut-weld. To obtain the best benefits and then to step up to `augmented' multiprocessing is necessary to improve and master each of the two processes, but under a radically different system design perspective, that is considering the combination among themselves, that with other laser and conventional processes, and that with the handling and jigging subsystems, always looking for interactions, synergies and false constraints.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aldo V. La Rocca, Luciano Borsati, and Maichi Cantello "Latest developments in laser manufacturing", Proc. SPIE 2207, Laser Materials Processing: Industrial and Microelectronics Applications, (7 September 1994); https://doi.org/10.1117/12.184781
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