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13 July 1994 Automated radiometric cryoprobe of IR focal plane array wafers
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Texas Instruments (TI) validated the feasibility of cryoprobing IRFPA arrays in late 1991. Since then, TI has developed a revolutionary automated cryoprobe for screening four and six inch wafers of IRFPAs. Generic prober automation features include cassette to cassette wafer load and unload, wafer alignment, black body selection, aperture selection, probe tip continuity test, and 77.5 degree(s) to 400 degree(s)K wafer temperature control. Modular construction of the prober enables placement of product specific components such as MWIR or LWIR bandpass filters, coldshield, coldfilter, probe card, and noise suppression circuitry on an easily removable `product specific' tooling plate. Prober operation is controlled through object oriented software. IRFPA specific software modules control array operation, data collection, and data reduction. In addition to describing the prober capabilities and versatility, this paper compares prober test data to lab dewar test data for 240 X 1 IRFPAs and projects benefits in reduced cycle time and labor savings.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stephen L. Whicker "Automated radiometric cryoprobe of IR focal plane array wafers", Proc. SPIE 2228, Producibility of II-VI Materials and Devices, (13 July 1994);


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