13 July 1994 Reactive ion etching (RIE) control by optical emission endpoint detection in IR focal plane array production
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The Microelectronics Manufacturing Science and Technology (MMST) program, a program mutually funded by ARPA, the U.S. Air Force, and Texas Instruments, was recently completed at TI and has had great impact on the fabrication of silicon-based devices. The MMST factory relied heavily on sensors to control processing and increase throughput and yield. It is our intent to utilize this MMST technology for infrared focal plane array (IRFPA) production. Aspects of our program to incorporate MMST technology into IRFPA production are discussed emphasizing the use of automated optical-emission-endpoint detection. Automated optical-emission-endpoint detection was successfully demonstrated on a RIE reactor. Optical emission was used to monitor as well as control our dielectric etch. The operation and application of optical emission endpoint detection for IRFPA fabrication are presented.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Glennis J. Orloff, "Reactive ion etching (RIE) control by optical emission endpoint detection in IR focal plane array production", Proc. SPIE 2228, Producibility of II-VI Materials and Devices, (13 July 1994); doi: 10.1117/12.179672; https://doi.org/10.1117/12.179672


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