29 June 1994 Holographic interconnects for 3D processors
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Abstract
This paper reviews two demonstration hardware devices built to show the advantages and potential of holographic optical interconnect techniques for use in a 3D optoelectronic computer architecture.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert L. Kaminski, Freddie Shing-Hong Lin, Cong T. Nguyen, Robert M. Mino, Peterlynn R. Bumacod, "Holographic interconnects for 3D processors", Proc. SPIE 2240, Advances in Optical Information Processing VI, (29 June 1994); doi: 10.1117/12.179125; https://doi.org/10.1117/12.179125
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