Paper
3 November 1994 MEBES IV position accuracy improvement on the 5-in. mask
Ki Jong Kim, Kun-Taek Park, Jung K. Oh, Hong S. Chun
Author Affiliations +
Abstract
As the wafer process requirements for the high grade devices are getting tighter than before, the requirements for the tighter accuracy of layer to layer among one device is dramatically increased up to the equipment specification itself that the equipment supplier propose thru their own test method. Eventhough the size of photomask is trend to the larger one as 6inch 25Omil and 7inch, still 5inch mask is the major product up to the l6mega memory device. Also, when we consider the required investment in wafer process to set up the large sized mask, the improvement of accuracy in 5inch mask is still realistic issue to the photomask manufacturer. In this paper, we evaluate the MEBES IV accuracy capability thru the acceptance test procedure of EFEC in 5inch mask and compare 5inch result with the 6inch result to clear the accuracy criteria of 5inch mask. Three major factors of position error which we suppose are identified using the factorial design of experiment. And the Ti super cassette is evaluated to clear the effect of cassette.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ki Jong Kim, Kun-Taek Park, Jung K. Oh, and Hong S. Chun "MEBES IV position accuracy improvement on the 5-in. mask", Proc. SPIE 2254, Photomask and X-Ray Mask Technology, (3 November 1994); https://doi.org/10.1117/12.191932
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KEYWORDS
Photomasks

X-ray technology

X-rays

Calibration

Factor analysis

Information operations

Aluminum

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