Using the Leitz LMS 2000 for monitoring and improvement of an e-beam

Carola Blaesing-Bangert; Klaus-Dieter Roeth; Yoichi Ogawa

doi:10.1117/12.191948

3 November 1994 Using the Leitz LMS 2000 for monitoring and improvement of an e-beam

Carola Blaesing-Bangert, Klaus-Dieter Roeth, Yoichi Ogawa

Proceedings Volume 2254, Photomask and X-Ray Mask Technology; (1994) https://doi.org/10.1117/12.191948
Event: Photomask Japan '94, 1994, Kawasaki City, Kanagawa, Japan

Abstract

Kaizen--a continuously improving--is a philosophy lived in Japan which is also becoming more and more important in Western companies. To implement this philosophy in the semiconductor industry, a high performance metrology tool is essential to determine the status of production quality periodically. An important prerequisite for statistical process control is the high stability of the metrology tool over several months or years; the tool-induced shift should be as small as possible. The pattern placement metrology tool Leitz LMS 2000 has been used in a major European mask house for several years now to qualify masks within the tightest specifications and to monitor the MEBES III and its cassettes. The mask shop's internal specification for the long term repeatability of the pattern placement metrology tool is 19 nm instead of 42 nm as specified by the supplier of the tool. Then the process capability of the LMS 2000 over 18 months is represented by an average c_pk value of 2.8 for orthogonality, 5.2 for x-scaling, and 3.0 for y-scaling. The process capability of the MEBES III and its cassettes was improved in the past years. For instance, 100% of the masks produced with a process tolerance of +/- 200 nm are now within this limit.

Citation Download Citation

Carola Blaesing-Bangert, Klaus-Dieter Roeth, and Yoichi Ogawa "Using the Leitz LMS 2000 for monitoring and improvement of an e-beam", Proc. SPIE 2254, Photomask and X-Ray Mask Technology, (3 November 1994); https://doi.org/10.1117/12.191948

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KEYWORDS

Metrology

Photomasks

X-ray technology

Process control

Tolerancing

X-rays

Critical dimension metrology

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