Paper
28 September 1994 Low-cost packaging of high-performance optoelectronic components
Author Affiliations +
Abstract
Optoelectronic component costs are often dominated by the costs of attaching fiber optic pigtails-especially for the case of single transverse mode devices. We present early results of our program in low-cost packaging. We are employing machine vision controlled automated positioning and silicon microbench technology to reduce the costs of optoelectronic components. Our machine vision approach to automated positioning has already attained a positional accuracy of less that 5 microns in less than 5 minutes; accuracies and times are expected to improve significantly as the development progresses. Complementing the machine vision assembly is our manufacturable approach to silicon microbench technology. We will describe our silicon microbench optoelectronic device packages that incorporate built-in heaters for solder bonding reflow.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mark E. Lowry, Shin-Yee Lu, Michael D. Pocha, and Oliver Ted Strand "Low-cost packaging of high-performance optoelectronic components", Proc. SPIE 2290, Fiber Optic Materials and Components, (28 September 1994); https://doi.org/10.1117/12.187433
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Packaging

Optoelectronic devices

Silicon

Machine vision

Optoelectronic packaging

Semiconductor lasers

Cameras

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