Yield enhancement through monitoring of real-time manufacturing processes

Neil Bryan Henis; Michael J. Satterfield; Edward O. Travis; Carol Gelatos

doi:10.1117/12.186739

14 September 1994 Yield enhancement through monitoring of real-time manufacturing processes

Neil Bryan Henis, Michael J. Satterfield, Edward O. Travis, Carol Gelatos

Author Affiliations +

Proceedings Volume 2334, Microelectronics Manufacturability, Yield, and Reliability; (1994) https://doi.org/10.1117/12.186739
Event: Microelectronic Manufacturing, 1994, Austin, TX, United States

Abstract

One of the major sources of particles today is from processing equipment. As die size continues to shrink, more effort needs to be placed in defect detection and elimination. A defect of 1 - 2 microns in size, while barely noticeable 5 years ago, can now destroy an entire die. Even with redundancy, a metal defect 1 micron in size will result in excess leakage due to an array short. While missing metal may be repairable, metal flakes from sputtering machines, for example, result in nonrepairable die. The objective of this paper is to show how backend defect reduction and yield enhancement can be improved with the use of the newer defect detection tools. We discuss three defect problems at different process levels which were discovered and eliminated with this work. The term `process induced defects per wafer pass' (PIDPWP) is demonstrated.

Citation Download Citation

Neil Bryan Henis, Michael J. Satterfield, Edward O. Travis, and Carol Gelatos "Yield enhancement through monitoring of real-time manufacturing processes", Proc. SPIE 2334, Microelectronics Manufacturability, Yield, and Reliability, (14 September 1994); https://doi.org/10.1117/12.186739

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