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TDR-like low-frequency circuit test and characterization system for package and module interconnects utilizing transient thermal signals
Optical profilometer featuring multiple virtual styli for the packaging and interconnect environment
Characterization of polycrystalline silicon grain boundary structures by optical second harmonic generation
Investigation of stress/strain of silicon on insulator using optical second harmonic generation method
Practical, nondestructive method to profile near-surface and subsurface defects in semiconductor wafers