14 September 1994 TDR-like low-frequency circuit test and characterization system for package and module interconnects utilizing transient thermal signals
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Abstract
A measurement system being developed for noncontact, nondestructive evaluation of package and module interconnects will be discussed. The system is capable of detecting interconnect faults in packages and module substrate layers. Low frequency impedance profiles of interconnects are also extracted. The potential advantages of this system over TDR systems result from the utilization of thermal signals obtained with an IR camera. Hence, they are noncontact measurements (requiring no probe fixtures) that are electrically passive and locally isolated even in an intact circuit. The main disadvantage of this testing method is that the interconnect under test must be planner with the traces exposed and visible to the camera. Therefore, in multilayer substrate structures, this method requires the testing to be conducted separately for each layer prior to assembly during substrate manufacture.
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Robert H. Flake, Robert H. Flake, D. B. Halstadt, D. B. Halstadt, Anthony Wong, Anthony Wong, Greg Pitner, Greg Pitner, Hosam Alhafez, Hosam Alhafez, } "TDR-like low-frequency circuit test and characterization system for package and module interconnects utilizing transient thermal signals", Proc. SPIE 2337, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing, (14 September 1994); doi: 10.1117/12.186649; https://doi.org/10.1117/12.186649
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