Optical measurement of solder bonds on printed circuit boards

Jeremy David Pearson; Francis Lilley; John T. Atkinson; David R. Burton; Anthony J. Goodall; Clifford Allan Hobson; Shirish P. Kshirsagar; David J. Search

doi:10.1117/12.195915

12 December 1994 Optical measurement of solder bonds on printed circuit boards

Jeremy David Pearson, Francis Lilley, John T. Atkinson, David R. Burton, Anthony J. Goodall, Clifford Allan Hobson, Shirish P. Kshirsagar, David J. Search

Author Affiliations +

Proceedings Volume 2340, Interferometry '94: New Techniques and Analysis in Optical Measurements; (1994) https://doi.org/10.1117/12.195915
Event: International Conference on Interferometry '94, 1994, Warsaw, Poland

Abstract

This paper describes research into a non-contact system for the measurement of components and solder on printed circuit boards (PCBs). The objective of the system is the inspection of the PCB to identify faults in the manufacturing process. Two approaches are described: diffraction pattern analysis and fringe pattern analysis. For the diffraction pattern analysis, a diffraction pattern is formed by the lead array on a component. For fringe pattern analysis, a fringe pattern is generated on the PCB using either interferometric methods or projection of a grating. For both methods, an image of the pattern is captured and stored on a frame store. The pattern is then processed to provide data from which parameters which relate to solder joint integrity can be determined. Results demonstrate the feasibility of the methods.

Citation Download Citation

Jeremy David Pearson, Francis Lilley, John T. Atkinson, David R. Burton, Anthony J. Goodall, Clifford Allan Hobson, Shirish P. Kshirsagar, and David J. Search "Optical measurement of solder bonds on printed circuit boards", Proc. SPIE 2340, Interferometry '94: New Techniques and Analysis in Optical Measurements, (12 December 1994); https://doi.org/10.1117/12.195915

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