12 December 1994 Optical measurement of solder bonds on printed circuit boards
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Abstract
This paper describes research into a non-contact system for the measurement of components and solder on printed circuit boards (PCBs). The objective of the system is the inspection of the PCB to identify faults in the manufacturing process. Two approaches are described: diffraction pattern analysis and fringe pattern analysis. For the diffraction pattern analysis, a diffraction pattern is formed by the lead array on a component. For fringe pattern analysis, a fringe pattern is generated on the PCB using either interferometric methods or projection of a grating. For both methods, an image of the pattern is captured and stored on a frame store. The pattern is then processed to provide data from which parameters which relate to solder joint integrity can be determined. Results demonstrate the feasibility of the methods.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeremy David Pearson, Jeremy David Pearson, Francis Lilley, Francis Lilley, John T. Atkinson, John T. Atkinson, David R. Burton, David R. Burton, Anthony J. Goodall, Anthony J. Goodall, Clifford Allan Hobson, Clifford Allan Hobson, Shirish P. Kshirsagar, Shirish P. Kshirsagar, David J. Search, David J. Search, } "Optical measurement of solder bonds on printed circuit boards", Proc. SPIE 2340, Interferometry '94: New Techniques and Analysis in Optical Measurements, (12 December 1994); doi: 10.1117/12.195915; https://doi.org/10.1117/12.195915
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