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4 January 1995 Infrared vision techniques in quality control of surface-mount circuit board solder paste printing
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Proceedings Volume 2349, Industrial Optical Sensors for Metrology and Inspection; (1995) https://doi.org/10.1117/12.198690
Event: Photonics for Industrial Applications, 1994, Boston, MA, United States
Abstract
In this work we have applied infrared camera techniques in a prototype of a quality control system for surface mount circuit board solder paste printing. The prototype system consists of a stepper motor controlled conveyor for board transportation and indexing, an infrared camera for paste pad temperature profile recording, a CCD camera for board and pad registration and recording, a pulse heating set-up, a video frame grabber and signal processor unit for preliminary image processing, and a PC for operator control, high level autonomous control and processing of preprocessed infrared and visual image data and communications with the other shop floor information and quality control systems. The operator interface is built on top of Windows 3.1, which makes it easy to operate and to connect to other programs at will. The prototype system was capable to process the locations and areas at over 100 solder paste pads per second speed and to evaluate the volumes of the pads within error tolerance of approximately equals 20%. The most severe obstacle in applying IR techniques in SMT product lines seems to be the current high cost of suitable IR scanning devices. Only slightly modified, the developed infrared quality control and testing system prototype can be used also in other electronics assembly line applications like solder checking and functional checking of boards by monitoring the thermal properties of solders and components correspondingly.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jarmo T. Alander, Mikko Huusko, Aimo Karonen, Jari Kuusrainen, and Lars Unonius "Infrared vision techniques in quality control of surface-mount circuit board solder paste printing", Proc. SPIE 2349, Industrial Optical Sensors for Metrology and Inspection, (4 January 1995); https://doi.org/10.1117/12.198690
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