8 September 1994 Investigations on ultrasonic bonding in microelectronics with real-time frequency analysis
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Proceedings Volume 2358, First International Conference on Vibration Measurements by Laser Techniques: Advances and Applications; (1994) https://doi.org/10.1117/12.185347
Event: Vibration Measurements by Laser Techniques: First International Conference, 1994, Ancona, Italy
Abstract
Build-up and bonding technology is of paramount importance for the manufacture of microelectronic components, since the reliability of electronic circuits depends in an essential manner on the quality of the connections responsible for the exchange of data and signals among the individual system components. A failure at only a single bonding site among as many as several hundred per component often results in failure of the entire system, and thus losses in the form of expenditures for production. The reproducible manufacture of the terminal contacts within very close tolerance limits is thus decisive for the quality and long-term reliability of the system.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ulrich Draugelates, Ulrich Draugelates, Karl-Heinz H. Koenig, Karl-Heinz H. Koenig, } "Investigations on ultrasonic bonding in microelectronics with real-time frequency analysis", Proc. SPIE 2358, First International Conference on Vibration Measurements by Laser Techniques: Advances and Applications, (8 September 1994); doi: 10.1117/12.185347; https://doi.org/10.1117/12.185347
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