High-aspect-ratio resist for thick-film applications

Nancy C. LaBianca; Jeffrey D. Gelorme

doi:10.1117/12.210413

9 June 1995 High-aspect-ratio resist for thick-film applications

Nancy C. LaBianca, Jeffrey D. Gelorme

Proceedings Volume 2438, Advances in Resist Technology and Processing XII; (1995) https://doi.org/10.1117/12.210413
Event: SPIE's 1995 Symposium on Microlithography, 1995, Santa Clara, CA, United States

Abstract

In recent years, increased activity in micromachining has driven the need for high aspect ratio thick films resist systems. This paper discusses a new epoxy based resist that can be used to achieve high aspect ratios (> 10:1) using UV lithography. The resulting negative resist system provides sharp, clean images in thick films (> 200 micrometers ). Because of the high aspect ratio and short exposure times, this material may be a viable candidate for producing the images required for micromachined parts. The resist images exhibit straight sidewalls and developed patterns, have excellent thermal stability, good adhesion, and chemical resistance. The high aspect ratio and high thermal stability make these epoxy resists suitable for other packaging applications such as plating stencils and optical wave guides.

Citation Download Citation

Nancy C. LaBianca and Jeffrey D. Gelorme "High-aspect-ratio resist for thick-film applications", Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); https://doi.org/10.1117/12.210413

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