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9 June 1995 Investigation of deep-ultraviolet photoresists on TiN substrates
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Abstract
The problem of deep ultraviolet (DUV) resist footing on titanium nitride (TiN) substrates has been studied using three different photoresists and TiN films of various stoichiometries. Multiple characterization techniques have been used to characterize the TiN films including auger electron spectroscopy, atomic force microscopy, Rutherford backscattering and reflectivity measurements. Resist footing was compared for process delay experiments, softbake temperature changes, and pretreatments to the TiN substrates. Based on these results and information previously published, it is concluded that detrimental surface and interface states exist on the TiN substrate which are principally reasonable for the footing.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kim R. Dean, Ronald A. Carpio, and Georgia K. Rich "Investigation of deep-ultraviolet photoresists on TiN substrates", Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); https://doi.org/10.1117/12.210358
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