9 June 1995 Lithographic performance of a positive photoresist for thick-film applications
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The process capability of a commercially available positive diazonaphthoquinone (DNQ) photoresist, SJR 3000 series from Shipley, was evaluated. This photoresist at a film thickness of 7 - 8 microns was found to have a large process latitude and focus budget while maintaining nearly vertical wall profiles. The high contrast found with this thick film photoresist was due to a low loading of a monofunctional DNQ sensitizer which also has a high dissolution inhibition. The photoresist formulation was compatible with both AZ 400K and Microposit (MP) 2401 developers when using either a stepper or scanner exposure system. SJR photoresist was shown to provide an effective photoresist frame for electroplating metals such as copper and permalloy.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alfred F. Renaldo, Alfred F. Renaldo, Laurie J. Lauchlan, Laurie J. Lauchlan, Donald C. Hofer, Donald C. Hofer, William D. Hinsberg, William D. Hinsberg, Dennis R. McKean, Dennis R. McKean, Hugo A.E. Santini, Hugo A.E. Santini, C. Grant Willson, C. Grant Willson, } "Lithographic performance of a positive photoresist for thick-film applications", Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); doi: 10.1117/12.210414; https://doi.org/10.1117/12.210414

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