9 June 1995 Lithographic performance of a positive photoresist for thick-film applications
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Abstract
The process capability of a commercially available positive diazonaphthoquinone (DNQ) photoresist, SJR 3000 series from Shipley, was evaluated. This photoresist at a film thickness of 7 - 8 microns was found to have a large process latitude and focus budget while maintaining nearly vertical wall profiles. The high contrast found with this thick film photoresist was due to a low loading of a monofunctional DNQ sensitizer which also has a high dissolution inhibition. The photoresist formulation was compatible with both AZ 400K and Microposit (MP) 2401 developers when using either a stepper or scanner exposure system. SJR photoresist was shown to provide an effective photoresist frame for electroplating metals such as copper and permalloy.
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Alfred F. Renaldo, Laurie J. Lauchlan, Donald C. Hofer, William D. Hinsberg, Dennis R. McKean, Hugo A.E. Santini, C. Grant Willson, "Lithographic performance of a positive photoresist for thick-film applications", Proc. SPIE 2438, Advances in Resist Technology and Processing XII, (9 June 1995); doi: 10.1117/12.210414; https://doi.org/10.1117/12.210414
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