Paper
26 May 1995 Total overlay analysis for designing future aligner
Nobutaka Magome, Hidemi Kawai
Author Affiliations +
Abstract
We found total overlay with respect to optical lithography using an approach similar to quality control technique employed at a semiconductor factory. This approach involves an aligner performance, process quality, reticle error and overlay measurement. This paper further describes new ides for the number of machines to be used for matching and data collection period. Lastly, improvement on total overlay and a prospective view for a future aligner and its usage are also described.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nobutaka Magome and Hidemi Kawai "Total overlay analysis for designing future aligner", Proc. SPIE 2440, Optical/Laser Microlithography VIII, (26 May 1995); https://doi.org/10.1117/12.209316
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Overlay metrology

Semiconducting wafers

Reticles

Distortion

Error analysis

Semiconductors

Optical alignment

RELATED CONTENT

Introduction of new techniques for matching overlay enhancement
Proceedings of SPIE (September 14 2001)
Overlay Simulator For Wafer Steppers
Proceedings of SPIE (January 01 1988)
New scanners for the 100-nm era
Proceedings of SPIE (September 14 2001)
Micrascan II overlay error analysis
Proceedings of SPIE (May 17 1994)

Back to Top