5 May 1995 Influence of adhesion on micromechanical behavior of SMA composites
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Abstract
Interfacial bond strengths of shape memory alloy wires embedded in a polymer matrix and subject to various surface treatments were estimated using pullout tests. Bond strength data was compared to in-situ wire displacements obtained using heterodyne interferometry. Experimental data shows that sandblasting of wires increases the bond strength while handsanding and acid cleaning actually decrease the bond strength. Plasma coating the wires did not significantly alter the adhesion strength. Comparisons with displacement data show that an increase in bond strength results in a decrease in displacement of the wire.
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Krish D. Jonnalagadda, Nancy R. Sottos, "Influence of adhesion on micromechanical behavior of SMA composites", Proc. SPIE 2442, Smart Structures and Materials 1995: Mathematics and Control in Smart Structures, (5 May 1995); doi: 10.1117/12.208834; https://doi.org/10.1117/12.208834
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