26 May 1995 Integration of electronic circuits with light modulators and lasers using direct bonding techniques for smart pixel applications
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Abstract
The integration of electronic logic and processing circuits of various complexity with sensing and actuating elements is needed for the realization of 'Smart' structures. Direct bonding techniques relies on topotoaxial integration of two dissimilar materials, one in thin film and the other in bulk forms. These techniques can deliver new smart structures by combining sensing and/or actuation components with high complexity logic circuits while preserving their performance. Integration of ferroelectric ceramics, multiple quantum well modulators and lasers with Si and GaAs electronic circuits is already demonstrated. Potential future implementation of the direct bonding technique will include the bonding of various electronic circuits to nonplanar, flexible and deformable substrates and combination with micromechanical structures.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Volkan H. Ozguz, Volkan H. Ozguz, } "Integration of electronic circuits with light modulators and lasers using direct bonding techniques for smart pixel applications", Proc. SPIE 2448, Smart Structures and Materials 1995: Smart Electronics, (26 May 1995); doi: 10.1117/12.210471; https://doi.org/10.1117/12.210471
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