Translator Disclaimer
Paper
7 July 1995 Thermal stressing techniques for flaw characterization with shearography
Author Affiliations +
Abstract
Controlled heating of a test specimen with a laser source provides several advantages for flaw detection using shearographic detection. This stressing method is non-contacting, can be localized, and allows defect information to be obtained while heating. In addition, the beam profile can be tailored to aid in the detection of different defect types. This paper presents results of simultaneous observations of material response to an applied thermal load using both TRIR and shearographic detection methods. Of particular importance is the demonstration that the depth of a defect can be determined by measuring the time-dependence of the shearographic fringe development during heating.
© (1995) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jane W. Maclachlan Spicer, John L. Champion, Robert Osiander, and James B. Spicer "Thermal stressing techniques for flaw characterization with shearography", Proc. SPIE 2455, Nondestructive Evaluation of Aging Aircraft, Airports, Aerospace Hardware, and Materials, (7 July 1995); https://doi.org/10.1117/12.213539
PROCEEDINGS
10 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

CIRiS: Compact Infrared Radiometer in Space
Proceedings of SPIE (September 19 2016)
What's Out There State Of The Art Survey Of...
Proceedings of SPIE (March 21 1983)
Thermal targets for satellite calibration
Proceedings of SPIE (March 23 2001)
Initial MTI on-orbit calibration performance
Proceedings of SPIE (November 15 2000)

Back to Top